PART |
Description |
Maker |
081029131240 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
081029132558 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions Package Outline Dimensions
|
List of Unclassifed Manufacturers List of Unclassifed Man...
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
TQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT263 |
Package outline
|
NXP Philips Semiconductors
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|